RFID Spotlighted at Pack Expo International
RFID will be in the spotlight at Pack Expo with a brand new pavilion focused specifically on the technology which the show's organizers say is driving basic changes in packaging.
"Yes, these changes free identification from line-of-sight constraints, add new dimensions to packaging's track-and-trace role and redefine how packaging lines will operate. But RFID's new problem-solving capabilities bring new hurdles, new choices and new challenges, as well," Pack Expo's promotional material states.
Other new pavilions will include a Package Security Resource Center and a new Showcase of Packaging Innovations.
Here is a look at what can be found at the RFID Pavilion:
- RFID technology providers with packaging operations experience.
- Systems integrators who have identified RFID solutions specifically for packaging operations.
- Packaging technology providers who offer RFID-enabled upgrades.
- RFID technology providers who offer "bolt-on" units for packaging equipment.
More than 50,000 attendees are expected, including over 6,000 international visitors from more than 75 countries.
Pack Expo International 2004 will feature 1,600-plus companies utilizing over 1.2 million net square feet of exhibit space.
The Food Processing Machinery Expo (formerly IEFP) will be co-located with Pack Expo International 2004. The focus of the Food Processing Machinery Expo will be on the newest developments in processing technology to meet the challenges faced by the industry's food and beverage manufacturers. FPM Expo exhibitors will demonstrate state-of-the-art equipment in the fruit and vegetable, beverage, canning/freezing, environmental, instrumentation, prepared foods, can making, meat, dairy and snack food industries.
Conference at Pack ExpoThe conference at Pack Expo will run Monday, November 8, to Wednesday, November 10. RFID and Electronic Product Code (EPC) presentations will also be a part of the conference at Pack Expo, a series of informational and educational programs designed to complement technologies seen on the show floor.
On Monday, Jeff Ettinger, pres./CEO of Hormel Foods will discuss how and why his company pushes for product and packaging innovations. Carl Garner of the federal Department of Defense will discuss the department's implementation of RFID technology, on Wednesday.
For a full schedule of conference programs visit www.packexpo.com.
More 50,000 attendees are expected, including over 6,000 international visitors from more than 75 countries.
McCormick Place, Lakeside, North and South Buildings
Chicago, Illinois, USA
9 am - 5 pm
Sunday, November 7-Wednesday, November 10
9 am - 2 pm
Thursday, November 11